Microelectronic and System-on-Chip Engineering, M.Sc.

  • N/A
    Application Deadline
  • 12 months
    Duration
  • Tuition
    16599
    Tuition (Year)
    5077
    Tuition (Year)
  • English (take IELTS)
    Language
,
This course brings together core techniques and technologies that cover relevant developments in System-on-Chip design, from micro and nano sensor systems to VLSI engineering and system integration, offering a broad coverage of material.
  • Overview
  • Programme outline
  • Key facts
  • Admission requirements
  • Fees and funding

About

This course brings together core techniques and technologies that cover relevant developments in System-on-Chip design, from micro and nano sensor systems to VLSI engineering and system integration, offering a broad coverage of material.

The curriculum is built around 6 learning modules which will provide both theoretical information and practical experience using commonly employed industrial tools. The key module topics are Microsystem and System-On-Chip Technology, Embedded System Design, Advanced Computer-Aided Design and Test, Real Time Systems, and Interfacing and Integration. Additionally each student will undertake a major individual project. The project allows students to extend their knowledge by exploring more fully an area that especially interests them.

Employability

Students who graduate from this course will have the multi-disciplinary skills to both contribute to and manage teams responsible for the design and integration of these advanced devices and systems into state-of-the-art products.

Programme Structure

Course Structure

This course can be taken as a full-time course or a part-time industry based course. The curriculum is built around six learning modules and a major individual project. Each module consists of lectures, tutorials and practical sessions. Modules are delivered by staff from Lancaster University and visiting experts from industry over intensive one or two week periods. For full-time students, the taught modules are complemented by both individual and team project-work.

The course modules include:

  • Microsystem and System-on-Chip Technology (ENGR510)
  • Advanced Computer-Aided Design and Test (ENGR524)
  • Real Time Systems (DCS)
  • Programming and Embedded Systems (Engr 402)
  • Interfacing and Integration (ENGR505)
  • Linking Project (ENGR530)

Detailed Programme Facts

  • Full-time duration 12 months
  • Study intensity Part-time, Full-time
  • Languages
    • English
  • Delivery mode
    On Campus

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Academic Requirements

Entry Requirements

At least a second class honours degree, or its equivalent, in an engineering discipline, mathematics or physics. An HND together with appropriate practical experience may also be acceptable.

Assessment: Combination of coursework and/or examination and a major project.

IELTS: 6.5

Tuition Fee Per Year

  • EUR 16599 International
  • EUR 5077 EU/EEA

Home/EU - £ 4,460 Overseas - £14,580

Funding

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